Silicon Nitride Products are made of sintered silicon nitride ceramic, which is a chemical compound of silicon and nitrogen (Si3N4) from the class of nitrides. Silicon nitride sintered products are characterized by various unique properties that make the application very interesting for a lot industrial applications. Due to its high strength and low thermal expansion coefficients, the material of silicon nitride components is ideally suited for thermal alternating loads. Sintered silicon nitride parts can still transmit very large forces even at temperatures around 1,000 degrees Celsius and can therefore be used well for soldering and welding applications.

Typical Applications

√ cutting tools	√ weld positioners	√ welding & brazing jigs
√ TIG / plasma welding nozzles	√ heating Element components	√ rotating ball & rollers bearings
√ induction heating coil supports	√ thermocouple sheaths & tubes	√ wear precision shafts and axles
√ metal tube forming rolls and dies	√ semiconductor process equipment	√ engine components: valve, seal face

Technical Characteristics

Properties of Silicon Nitride Products

Development Trend

Si3N4 Silicon Nitride material has excellent mechanical properties and fracture toughness. In the past, it was mainly used in quite harsh environments, such as military, semiconductor, precision machinery, etc., and the demand was stable. However, there have been substantial market changes recently: For example, Si3N4 silicon nitride powder material used in masks can inhibit the spread of coronavirus; and its fast charge and discharge stability characteristics have become an emerging research direction for lithium battery anode materials; With the development of the third-generation semiconductor and electric vehicle industries, high-power modules have a large demand for ceramic substrates with high resistance and high thermal conductivity, resulting in a large increase in the demand for Si3N4 silicon nitride powder and substrates. At the same time, in order to better meet the stability requirements of the future automotive industry, the characteristics of the materials will be developed towards high reliability and high thermal conductivity. For example, the thermal conductivity has moved from the current 80 W/m·K to the target of 170 W/m·K. The key to development lies in the composition of new materials, forming processes, sintering processes, and microstructure control and other methods that can be further refined.

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