TO-247 plate is a widely used for transistor or power semiconductor package. It has a variety of uses in electronic circuits, primarily for power management and heat dissipation. The TO-247 pad is usually connected to the internal semiconductor chip, acting as a heat sink to dissipate the heat generated during operation. It is often connected to an external heat sink or thermal interface material (such as thermal pads, grease, or ceramic heat sink) to improve cooling efficiency. In many devices, TO-247 is electrically connected to the collector (in a BJT), drain (in a MOSFET), or cathode (in a diode). It serves as both a thermal and electrical conductor, reducing wiring and improving performance.
What ceramic materials are often used for TO-247 thermal pad?
Ceramic materials are often used for TO-247 heat sink plates because of their excellent thermal conductivity, electrical insulation, and resistance to high temperatures. Common ceramic materials for heat sink plates include:
Alumina Ceramic Plate, it's high thermal conductivity (though lower than AlN and Si₃N₄), excellent electrical insulation, and high mechanical strength and thermal stability. Alumina thermal pad TO-247 is usually used for general-purpose heat sinks in electronics. It's a cost-effective option compared to other ceramics.
Aluminum Nitride (AlN) ceramic is another option for TO-247 pad. It has superior thermal conductivity (up to 170-200 W/m·K), excellent electrical insulation and high resistance to thermal shock. AlN TO-247 plate is commonly used for high-performance elctronics and LED heat sinks, or applications when thermal management is critical.
Silicon Nitride (Si3N4) ceramic can also be used for TO-247 plate. It has superior thermal conductivity (up to 80 W/m·K), high strength and toughness, and exceptional resistance to thermal and mechanical shock. It's applied for heat sink when thermal conductivity and thermal shock resistance are both critical points.
Applications of TO-247 packages
Power transistors (BJTs, IGBTs, and MOSFETs).
Diodes and rectifiers.
Voltage regulators.
Solid-state relays.
High-power converters and inverters.
Mounting and Isolation
Regular pad size for power transistor
TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258,
It can be with or without holes, and thickness can be others(0.38/0.5/1.5/2.0mm).
25 x 20 x 0.635/1.0mm
20 x 14 x 0.635/1.0mm
22 x 17 x 0.635/1.0mm
28 x 22 x 0.635/1.0mm
39.7 × 26.67 x 0.635/1.0mm
34 x 24 x 0.635/1.0mm
40 x 28 x 0.635/1.0mm
50.8 × 50.8 x 0.635/1.0mm
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Tel: +0086 18650119402
Email: info@unipretec.com
