Products
Alumina Ceramic Substrate
Density : 3.70 g/cm3
Color : White
Max. Working Temperature : 1,500 degree C
Application : Chip Resistor, Power Modules, LED Packages, General Isolator

With the development of electronic equipment, the power is getting higher and higher and the element is getting smaller and smaller, so the requirements for thermal conductivity are getting higher and higher, the previous thermal insulation materials have been more and more unable to meet the demand. In this case, alumina ceramic substrate as a high thermal conductivity and high insulation ceramic material, with 25W/m.k thermal conductivity and 17KV dielectric strength, has become a more and more popular substrate choice of many high-power equipment, compared to the silicon sheet substrate with thermal conductivity only 0.6W/m.k, and the dielectric strength of alumina Al2O3 substrate is also only 2KV. Relying on exceptional performance and very high price/performance ratio, the application of alumina substrate has become wider and wider. As we all know, ceramic is fragile, but our company relies on advanced equipment and many years of production experience, the strength of the production of tape casting alumina substrates on the original basis of the strength greatly improved!
If your products have the following problems, you can choose alumina sheet substrate.
1. More than half an hour after the start-up, there is a fryer, burning pipe phenomenon, need circuit inspection without abnormality.
2. Power on for a period of time, measuring the tube waveform from normal to abnormal deformation state.
3. Hand touch tube is very hot, and the heat dissipator does not heat the situation.
4. After the product is sold, for a long time, the customer returns the pipe-burning machine.
5. Equipment for thermal insulation requirements are high.
Material Properties(A960)
ITEM | UNIT | A960 | ALN |
Main Content | - | Al2O3 > 96% | AlN > 95% |
Density | g/cm3 | > 3.7 | > 3.3 |
Color | - | White | Grey |
Water Absorption | % | 0 | 0 |
Warpage | - | < 2‰ | < 2‰ |
Surface Roughness (Ra) | um | 0.2 - 0.7 | 0.3 - 0.6 |
Flexural Strength | Mpa | 380 | 440 |
Thermal Conductivity (25 ℃) | W/m.K | > 25 | > 175 |
Thermal Expansion Coefficient (25 - 300 ℃) | 10-6 mm/℃ | 6.5 - 7.5 | 2 - 3 |
Thermal Expansion Coefficient (300 - 800 ℃) | 10-6 mm/℃ | 6.5 - 8.0 | 2.5 - 3.5 |
Max. Working Temperature | ℃ | 1,200 | 1,200 |
Dielectric Strength | KV/㎜ | > 17 | > 17 |
Dielectric Constant | 1 MHz | 9 - 10 | 17 |
Electrical Resistivity (25 ℃) | Ω·cm | > 1014 | > 1014 |
∆ The above data is offered for reference and comparison only, exact data will vary depending on manufacturing method and part configuration.

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