Unipretec provides special differential scribing to enhance preferential singulation. More exact control over the singulation sequence is achieved by adjusting the laser pulse spacing and depth in the (x) and (y) scribe directions separately. Improved laser scribing increases process yields by reducing the risk of hooking, chipping, and premature breaking.

Unipretec offers a comprehensive range of laser machining, drilling, scribing, profiling, and annealing services to ensure that your substrates are precisely what you require for your intended use.

When alumina ceramic substrate used as electronic substrate, its thickness and surface quality are very important. A "rugged" surface makes it difficult to ensure that circuits deposited on electronic components can have good accuracy. Therefore, grinding and lapping can be used to make the alumina electronic substrate smooth. We have high-precision surface processing equipment, with high mechanical structure strength and stable accuracy. The grinding substrate surface roughness is Ra0.3-0.7um, and the polishing finish is around Ra0.05.

Direct Copper Bonding (DCB): Add oxygen element between copper and ceramics to obtain Cu-O eutectic liquid at a temperature of 1065-1083°C, and then react to obtain an intermediate phase (CuAlO2 or CuAl2O3), thereby achieving chemical metallurgical bonding of the Cu plate and the ceramic substrate. Finally, pattern preparation is achieved through photolithography technology to form a circuit. The DBC substrate has the advantages of similar thermal expansion coefficient to aluminum oxide, good thermal conductivity, strong insulation, and high reliability. In addition, the metallization process is relatively simple and the cost is low.

Direct Plating Copper (DPC) process: It is a process used to prepare high-density electronic packaging materials. This process is the main method for metal film deposition in microelectronics manufacturing. It mainly uses surface deposition processes such as evaporation and magnetron sputtering to metallize the substrate surface.

The magnetron sputtering process (below 300°C) completely avoids the adverse effects of high temperature on materials or circuit structures, and also reduces manufacturing process costs; it uses thin film and photolithography development technology to make the metal circuits on the substrate finer (line width 20-30um, line alignment accuracy error is less than ±1%), so DPC substrate is very suitable for electronic device packaging with high alignment accuracy requirements; surface roughness is less than 0.5um, more suitable for high precision refrigeration chip packaging.